The future of CPUs?

September 15th, 2011 in .News & Events
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In computing, Moore’s Law describes a trend that we can expect the number of transistors on processors to double about every two years, and for the last half century, it’s held true. With the latest announcement from IBM and 3M, expect that trend to be shattered. They claim that by applying a heat dissipating adhesive in between each CPU, they can stack microprocessors on top of each other up to 100 layers thick and up to 1000 times faster than today’s fastest microprocessors.

While we’re still a few years off before seeing it in the hands of everyday consumers, it will no doubt change the landscape for home computers, notebooks and even mobile phones. Wherever technology takes us, ASUS will always innovate to match!

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  • Vishal

    Great! Applying a heat dissipating adhesive between multiple CPU layer can make a stacked 1000 time faster microprocessor than today’s fastest one.
    It means we will use super Computer at home in future.

  • Luca Lolaico

    Le applicazioni saranno anche 1000 volte + pesanti!!non vuol dire niente,questo studio è rivolto alle architetture del futuro con applicazioni del futuro non con roba che c’è adesso!!