AMD Ontario performance leaks – Are there new Eee’s on the horizon?

August 4th, 2010 in .Blogs .Tech
Nick Holland
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AMD upcoming Ontario APU performance has recently leaked over at Hardware Info, and on the raw stats alone it looks impressive: 2x Intel’s latest Atom D510 performance, plus, a full DirectX 11 graphics core built in too – all in just an 18W power envelope!

Wow. Serious, Wow!

It should bridge the gap between Intel’s Atom and CULV, and overlap the ageing Intel Atom+ Nvidia Ion segment too.

It can get away with all this because it has AMD’s new APU ‘Fuzion‘ technology at the helm. Essentially the CPU and graphics not just on the same physical die – they are mushed together like butter and mashed potato: you can still taste the salty butter and starchy veg, but they work together better than separate foods. The inbuilt DDR3 memory controller also gets some die space too, and it’s all made using the latest, lower power 40nm process – an upgrade from 45nm in AMD’s current CPUs.

This means that unlike Intel’s Atom, CULV or Nvidia’s Ion parts that need two extra chips – it only needs a single low power ‘southbridge’ chip to connect up a hard drive, USB and PCI-Express bits to make a complete system.

Altogether this means AMD’s upcoming APU should fit inside devices as small as 10 inches, through 12 and 13 inches, covering ‘ultra portable’, through to ‘ultra-thin’ markets giving us a long sought missing ingredient: variety and consumer choice.

Right now we have been pretty much limited to buying Atom derivative netbooks for the last a few years – certainly almost Intel exclusive, apart from a brief liaison with AMD’s Neo by a few manufacturers. Intel’s CULV never dropped below the 12 inch market, and while the Intel Atom suffices for basic web browsing, social media, office work and youtube, with increasingly visual rich OS’ and internet services, having a more umpf at your disposal is definitely a good thing.

AMD’s Ontario should arrive late Q4 with laptops and netbooks – including designs by ASUS – are rumoured to appear during Q1 next year. We certainly hope to see some new Eee PCs, as it would reinvigorate a market that has had its ‘cuteness and sexiness’ sucked out by the tablet revolution. That said, the two are not interchangable and each has its place – and with a deluge of tablets also due in Q1 as well, it’s going to be a cracking and extremely expensive time to be a technophile!

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  • mrroy

    “…giving us a long sought missing ingredient: variety and consumer choice.”

    WHAT DO YOU MEAN? ARE YOU IMPLYING THAT INTEL HAS BEEN BRIBING AND COERCING MANUFACTURERS TO CAP AMD’s MARKET SHARE AT A PREDETERMINED MARKET SHARE FOR THE LAST DECADE??

    Here is a great summary of the unbelievable, illegal activities of “EVIL INSIDE” Intel.

    http://money.cnn.com/2010/07/27/news/companies/dell_settlement_intel.fortune/

    “…Thus, the SEC has now become the sixth regulatory body worldwide — and the third in the United States — to conclude that Intel made improper payments throughout much of the last decade to persuade computer makers to bar or sharply limit their use of AMD chips. Though these payments allegedly began in 2001, under Intel’s now retired CEO Craig Barrett, the practice allegedly continued and expanded under Intel’s current CEO, Paul Otellini, according to the SEC.”

    “ntel’s total MCP payments to Dell for that quarter (ending May 5, 2006) peaked at $723 million, accounting for 76% of Dell’s reported operating income, according to the SEC. Cumulatively to this point, Intel’s MCP payments to Dell now totaled $4.3 billion. Nevertheless, Dell still missed analysts’ estimates for that quarter by 5 cents, prompting its stock price to fall 9%. On May 18 Dell announced that it would begin shipping AMD-powered products by yearend, allegedly prompting Intel to retaliate by cutting its MCP payments by $263 million. Dell’s operating income fell precipitously,…”

    Intel is EVIL INSIDE!!!!

  • http://techinstyle.tv Nick

    Not necessarily. AMD openly said when Atom launched it was never interested in making a direct competitor, and developed the ‘Ultra-thin’ range of Athlon Neo chips, which Intel responded with its CULV.

    VIA also has had limited success with its Nano chips in a few netbook designs (Samsung and Lenovo for example) but is focusing its efforts on other markets.

    OK, Intel is well known to offer its MDF as part of an incentive package, but whose to say that other manufacturers don’t want to ship a very low cost chip that will lower their overall average selling price? It’s likely they simply don’t have the manufacturing volume either. Both VIA and AMD have to go to other companies to get their stuff made.

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